Samsung Electronics said its contract manufacturing business plans to provide a one-stop shop for customers to produce their AI chips faster, integrating memory chip, foundry and chip packaging services 1 globally to exploit the AI boom.
With customers working with a single communication channel directing Samsung’s memory chip, foundry and chip packaging teams at the same time, the time required to produce AI chips – typically weeks – has been reduced about 20%, Samsung said Wednesday.
“We are truly living in the age of AI – the emergence of next-generation AI is changing,” said Siyoung Choi, President and CEO, Foundry Business, at a Samsung event in San Jose, California. complete technological landscape”.
Choi said Samsung expects global chip industry revenue to increase to $778 billion by 2028, driven by AI chips.
At a briefing with reporters before the event, Foundry Executive Vice President of Marketing and Sales Marco Chisari said the company believes OpenAI CEO Sam Altman’s loose predictions about demand Skyrocketing demand for AI chips is real.
Altman has told executives at contract chipmaker TSMC that he wants to build about three dozen new chip factories, Reuters previously reported.
Samsung is one of the few companies that sells memory chips, providing foundry and chip design services under one roof. That combination has often proved disadvantageous in the past, as some customers worried that doing business with their foundry could benefit Samsung as a competitor in another sector.
However, with the growing demand for AI chips and the need for all chip components to be highly integrated to train or infer huge amounts of data quickly using less power, Samsung believes that Its turnkey method will be its strength in the future.
The South Korean tech giant also introduced an advanced chip architecture called comprehensive gate (GAA), a type of transistor architecture that improves chip performance and reduces power consumption.
GAA is seen as vital to continuing to create more powerful chips for AI as chips become finer to the point of transcending physical boundaries.
Although competitors such as global No. 1 manufacturer TSMC are also researching chips using GAA, Samsung started applying GAA earlier and said it plans to mass produce 3-nanometer chips like that. The second generation uses GAA in the second half of this year.
Samsung also announced its latest 2-nanometer chip manufacturing process for high-performance computing chips, placing power rails on the back of the wafer to improve power delivery. Mass production is expected in 2027.
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