Samsung introduces GDDR6 memory with huge capacity upgrade
Samsung has announced all-new GDDR6 memory that is set to address the “big memory and increased computing power” requirement often required by a client to create objects and environments in virtual space.
The company calls this “the industry’s first next-generation graphics DRAM technology,” which improves upon traditional GDDR6 products by adding an additional DRAM device to dramatically double capacity and bandwidth. efficient without the associated effects you would normally expect such as a larger form factor.
Samsung hopes that the GDDR6W will achieve these benefits by using the same power consumption as GDDR6, which the chipmaker hopes will allow customers to use the newer technology without having to do the heavy lifting. major changes to existing hardware.
Samsung GDDR6W
This is managed by what Samsung calls Fan Out Wafer Level Encapsulation (FOWLP) technology.
Smart packaging also sees the traditional printed circuit board (PCB) replaced with a redistributable layer, allowing for a more compact design with thinner wire patterns, reducing conventional package thicknesses from 1, 1 mm down to 0.7 mm.
The stacking involved in building FOWLP is also said to cut production time and costs in a world where companies and consumers are looking to squeeze their spending.
“With GDDR6W, we are able to promote differentiated memory products that can meet different customer needs – an important step in securing our leadership position in the market,” said CheolMin. Park, Vice President of New Business Planning, Samsung’s Electronic Memory Business, explains.
Samsung hopes to use GDDR6W for AI and high-performance compute accelerators, but it has also announced plans to bring GDDR6W down to a smaller form factor to fit in devices like laptops.
While the likes of AMD and Nvidia are yet to support GDDR6W, Samsung plans to work with its GPU partners to speed up deployment.