Launched MediaTek Dimensity 7200 Octa-Core SoC with 5G support under 6GHz, 200 Megapixel camera: Details

The MediaTek Dimensity 7200, the chipmaker’s first offering in the new Dimensity 7000 series, was launched on Thursday. According to the company, the chip offers advanced AI photography features, supports a 200-megapixel camera, and supports 5G Sub-6GHz networks, and offers greater efficiency for extending battery life. The chip also uses the second-generation 4nm process by Taiwan Semiconductor Manufacturing Company (TSMC) used in the Dimensity 9200 chip. The company added that the new Dimensity 7200 will power the devices. 5G devices will be launched in the first quarter of 2023.

The company’s new Dimensity 7200 is ideal for thin smartphones, according to Mediatek. The octa-core CPU combines two Arm Cortex-A715 performance cores with up to 2.8GHz operating speed with six Cortex-A510 performance cores with 2.0GHz clock speed. MediaTek’s built-in AI processor (APU) is said to optimize the efficiency of AI tasks and combine AI processing for more power and performance.

Meanwhile, MediaTek’s HyperEngine 5.0 technology can help save power by using AI-based Variable Scaling (VRS) while intelligent resource optimization for CPU and GPU will bring longer battery life, according to the chip manufacturer. The chipset includes the Arm Mali G610 MC4 GPU.

The newly launched chipset will support a 200-megapixel main camera using MediaTek’s Imagiq 765 and a 14-bit HDR-ISP (image signal processor). The chipset supports 4K HDR video recording, and MediaTek says users can even capture subjects from the two cameras in Full HD resolution while keeping everything in focus with the company’s full-pixel autofocus technology. the firm.

According to the company, MediaTek’s new SoC includes motion compensation noise reduction, to improve night and low-light photography. The APU will also support advanced AI-Camera features including real-time portrait beautification.

The Dimensity 7200 supports standard 5G Sub-6GHz connectivity with up to 4.7Gbps downlink, tri-band Wi-Fi 6E and Bluetooth 5.3. It also has a fully integrated 5G modem and MediaTek’s 5G UltraSave 2.0 technology suite.

The chipset supports 2CC Carrier Aggregation and dual 5G SIM with dual VoNR (New Voice over Radio) providing consistent coverage everywhere, according to the company.

Meanwhile, the MediaTek Dimensity 7200 SoC also supports UFS 3.1 storage, the MediaTek MiraVision Display supports the latest standards including HDR10+, CUVA HDR and Dolby HDR. It will support displays up to Full HD+ with 144Hz refresh rate, AI SDR-to-HDR video playback for improved multimedia experience, and Bluetooth LE Audio and Dual-Link True Wireless Stereo Audio technology to Support wireless headset. As mentioned earlier, the newly launched Dimensity 7200 chipset will arrive on new devices in Q1 of 2023.