In addition to a wide range of laptop CPUs and GPUs, AMD CEO Dr. Lisa Su also made numerous desktop and data center product announcements at CES 2023’s opening keynote. she’s in Las Vegas. The top-end Ryzen 7000 X3D series CPUs with integrated 3D Vcache are billed as the world’s most powerful CPUs for gaming, replacing the recently launched Ryzen 9 7950X at the top of AMD’s stack. There are also new mainstream desktop CPUs with limited overclocking support, which AMD promises will hit attractive prices. The new Instinct MI300 is what AMD calls the world’s first integrated data center chip, combining CPU and GPU cores plus more, while the new Alveo A70 plug-in accelerator card takes advantage of the new Instinct MI300. The company’s new XDNA AI accelerator architecture.
According to the unique model in the previous generation with built-in 3D Vcache, Ryzen 7 5800X3D which AMD Billed as the world’s fastest gaming processor, three options are available. The new flagship Ryzen 9 7950X3D has 16 cores and 32 threads, with a whopping 144MB total cache. It has a 120W TDP rating and a 5.7GHz boost speed. It will be aimed at people who play games and also run heavy content creation workloads. It is said to deliver up to 24% better gaming performance than the previous generation.
There’s also the Ryzen 9 7900X3D with 12 cores and 140MB of cache and the Ryzen 7 7800X3D with eight cores and 104MB of total cache. The Ryzen 7000 X3D CPU series will be available in the market in February 2023 and pricing will be announced after that.
In addition, there are three new main lines CPU Ryzen 7000 target a TDP level of 65W. Retail CPUs will ship with the cooler in the box. The 12-core Ryzen 9 7900 will cost $429, the 8-core Ryzen 7 7700 for $329 and the Ryzen 5 7600 for $229. All three will go on sale on January 10.
Su also announced that select Ryzen 7000 CPU buyers will receive a free copy of the Star Wars Jedi: Survivor when it becomes available.
The Instinct MI300 is claimed to be the world’s first integrated data center chip with CPU, GPU and memory combined in one package. It has 24 CPU cores based on Zen 4 architecture, CDNA3 compute accelerator architecture and 128GB HBM3 memory. This chip is built using advanced 3D stacking technology with nine 5nm chiplets on four 6nm chiplets. In total, it contains more than 146 billion transistors and is the most complex chip AMD has ever designed. The company claims 8x efficiency and 5x more efficiency than the previous generation Instinct MI250X HPC accelerator. It will allow processing of larger AI models much faster, at a lower cost and with significantly less power consumption. It will soon be sampled for HPC and AI customers and will be available in the market in the second half of 2023.
The AMD Alveo A70 is a low profile add-on card based on the new AI XDNA architecture that AMD says will scale across products and address multiple segments, the Alveo A70 is optimized for AI inference and power efficiency, and is said to be 80 percent more efficient than the competition from Nvidia, in AMD’s own tests. It is currently available for AI cloud infrastructure developers to pre-order.
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